- News
9 March 2018
II-VI participating at OIDA Executive Forum and presenting in Data Center Summit at OFC
© Semiconductor Today Magazine / Juno PublishiPicture: Disco’s DAL7440 KABRA laser saw.
Engineered materials and optoelectronic component maker II-VI Inc of Saxonburg, PA, USA says that president & CEO Dr Chuck Mattera is participating at the Optical Society of America Industry Development Associates (OIDA) Executive Forum’s ‘Special CEO Fireside Chat: The View from the Top’ at the Hilton Bayfront Hotel (Sapphire AB Ballroom) in San Diego on 12 March (4:05pm), which features CEOs from leading companies in the optical components industry providing their perspectives on a broad range of industry issues.
In addition, at the Optical Fiber Communication Conference & Exhibition (OFC 2018) in the San Diego Convention Center, CA, USA (12-15 March), Dr Sanjai Parthasarathi (VP of product marketing & strategy, Optical Communications Group) will be a panelist at the OFC 2018 Data Center Summit ‘Data Center Optical Interconnect – Technologies and Markets’ on 13 March (10:15am), discussing advances in optical line systems for emerging data-center interconnects.
Also at OFC, II-VI is exhibiting in booth #2313, showcasing the following new products:
- CTM 1450 high-resolution optical channel monitors for flexible-grid reconfigurable optical add-drop multiplexers (ROADMs);
- ultra-low-profile wide-band tunable optical filters for next-generation pluggable coherent optics; and
- bi-directional optical line subsystem (Bi-Di OLS) platform for data-center interconnects (DCI), optimized for direct-detect DWDM transceivers, including the new COLORZ-Lite 100G PAM4 platform from Inphi Corp (demonstrated at II-VI’s booth #2313).
The product showcase will include a broad portfolio of products for ROADM line cards, highly compact optical amplifier solutions tailored to enable high-bit-rate DWDM transceivers, micro-optics assemblies for CATV networks, micro-optics and optoelectronics for data-center transceivers, indium phosphide (InP)-based epiwafers, and thermo-electric solutions.
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