29 January 2018
POET introduces Optical Interposer Platform for co-packaging of electronic and optical components
© Semiconductor Today Magazine / Juno PublishiPicture: Disco’s DAL7440 KABRA laser saw.
POET Technologies Inc of Toronto, Canada and San Jose, CA, USA —a designer and manufacturer of optoelectronic devices, including light sources, passive waveguides and photonic integrated circuits (PIC) for the sensing and datacom markets — has unveiled an Optical Interposer Platform that facilitates the co-packaging of electronics and optics in a single multi-chip module (MCM).
Based on its previously announced dielectric waveguide technology, POET’s Optical Interposer provides the ability to run electrical and optical interconnections side-by-side on the same interposer chip at the micron scale. It represents an integral part of POET’s hybrid integrated optical engines and leverages the manufacturing processes and unique capabilities of its dielectric waveguides.
As the need for higher data transfer speeds at greater baud rates and lower power levels increase, optics will move increasingly closer to the source of the data, whether it be a processor, application-specific integrated circuit (ASIC) or field-programmable gate array (FPGA), says POET. The Optical Interposer Platform enables an optoelectronic interconnect fabric to interface directly with the source of data to support high-speed optical data transfer from within the MCM. Additionally, the technology is projected to offer cost-efficient optical interconnects, allow for a reduction in components, and reduce test & assembly steps to decrease manufacturing costs.
POET believes that its Optical Interposer Platform, targeting 100G transceiver applications, is readily scalable to 200G and 400G transceiver products with minimal incremental cost. Also, its scalable architecture (in reach and speed) has the potential to provide a highly differentiated competitive advantage in leading-edge datacom transceivers, reckons the firm.
The Optical Interposer has applications in a wide range of high-growth markets, primarily high-performance computing, networking, optical transceivers and transponders, and automotive LiDAR (light detection and ranging) systems. The platform technology is applicable to both gallium arsenide (GaAs)- and indium phosphide (InP)-based optical components. Optical engines for single-mode transceiver modules represent the initial high-volume application.
POET also says that it has completed development of its low-loss dielectric waveguide stack and is readying the technology for transfer to manufacturing. As part of its continued technology development, POET has demonstrated a 10x improvement in the optical loss of its waveguide stack compared with the performance publicly disclosed at the Photonics Integrated Circuit (PIC) conference in March 2017. Optical transmission loss within the dielectric stack has now been measured to be below 0.2dB/cm, which renders the stack virtually loss-less for most practical applications. The ability to deposit low-loss and low-stress dielectric waveguides is the first critical step to enabling complex functionality of these waveguides in key applications, such as arrayed-waveguide gratings (AWGs), échelle gratings, laterally coupled gratings, multi-mode interference (MMI) couplers and splitters, and pass-through waveguides. These functional features are integral to enabling the performance of a transceiver optical engine and essential to the performance of the multiplexer/de-multiplexer component required in wavelength-division multiplexing (WDM) systems.
Consistent with prior expectations, POET continues to work toward providing engineering samples of a receive optical engine to customers by mid-2018. The device will be fabricated leveraging the Optical Interposer Platform.
Through its subsidiary DenseLight Semiconductors, POET is participating at SPIE Photonics West 2018 in San Francisco (27 January – 1 February).