, Disco develops DAL7440 KABRA laser saw for 8-inch SiC wafers

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9 January 2018

Disco develops DAL7440 KABRA laser saw for 8-inch SiC wafers

© Semiconductor Today Magazine / Juno Publishing

Picture: Disco’s DAL7440 KABRA laser saw.

Tokyo-based equipment maker DISCO Corp has developed DAL7440, a laser saw that supports KABRA processing of 8-inch silicon carbide (SiC) wafers.

In the KABRA (Key Amorphous-Black Repetitive Absorption) slicing process, by continuously irradiating the laser vertically from the upper surface of the ingot, a separating layer that absorbs light is formed into a flat shape at the desired depth, enabling peeling and formation of wafers from this point.

At SEMICON Japan 2016 DISCO exhibited the DAL7420 laser saw (measuring 600mm x 1045mm x 1778mm), which supports KABRA processing of 6-inch wafers. However, R&D to enlarge wafer diameter has been progressing, involving for example the shipping of 8-inch sample wafers.

In response to this, as well as strong demand from wafer manufacturers, the DAL7440 laser saw (which measures 750mm x 1350mm x 1800mm) has been developed, to support KABRA processing of 8-inch wafers.

Maximum ingot thickness is 40mm (with a function for measuring ingot thickness). The system is alignment-free, thanks to an orientation flat detection function using auto alignment. A wafer printing function tracks the total number of processed wafers. In addition to 8-inch diameter ingots, the DAL7440 also supports future increases in ingot diameter.

In March, the DAL7440 will be set up in DISCO’s North Carolina office (Disco Hi-Tec America Inc) to more flexibly handle requests for processing tests in the USA.

See related items:

Disco’s KABRA!zen fully automates KABRA laser slicing technology

Disco develops laser ingot slicing method to speed SiC wafer production and cut material loss

Tags: SiC

Visit: www.disco.co.jp

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