, Comtech wins $1.3m solid-state power amplifier order for in-flight connectivity

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16 January 2018

Comtech wins $1.3m solid-state power amplifier order for in-flight connectivity

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Comtech Telecommunications Corp says that during fiscal second-quarter 2018 its subsidiary Comtech Xicom Technology Inc of Santa Clara, CA, USA – a part of Comtech’s Commercial Solutions segment that makes tube-based and solid-state power amplifiers (SSPAs) for military and commercial satellite communication (SATCOM) uplink applications – received an order worth more than $1.3m for solid-state power amplifiers (SSPAs) for use in an airborne in-flight connectivity (IFC) system.

“This order is for the increasingly active IFC market, and further extends an ongoing production run,” notes Comtech Telecommunications’ president & CEO Fred Kornberg. “Customers have embraced the high reliability and efficiency of our GaN [gallium nitride] technology and value the added benefit of small size and weight, especially for airborne systems.”

Earlier, in mid-December, Comtech Xicom received a separate SSPA order worth more than $9.4m, also for airborne IFC (enabling high-speed satellite connectivity in the cabin). “Travelers expect fast and reliable broadband satellite connectivity in the air,” says Kornberg. The order supports continued production of this product through the latter part of 2018.

Comtech Xicom Technology’s product range encompasses power levels from 8W to 3kW, with frequency coverage in sub-bands within the 2-51GHz spectrum. Amplifiers are available for fixed and ground-based, ship-board and airborne mobile applications.

See related items:

Comtech wins $7.5m solid-state power amplifier order for in-flight connectivity

Comtech awarded $11.8m order for solid-state power amplifiers for in-flight connectivity

Tags: GaN HEMT Satcoms

Visit: www.xicomtech.com

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