26 February 2018
MACOM showcasing next-gen cloud data center and 5G connectivity solutions at OFC
© Semiconductor Today Magazine / Juno PublishiPicture: Disco’s DAL7440 KABRA laser saw.
In booth #2613 at the Optical Networking and Communication Conference & Exhibition (OFC 2018) in San Diego (13–15 March), MACOM Technology Solutions Inc of Lowell, MA, USA (which makes semiconductors, components and subassemblies for RF, microwave, millimeter-wave and lightwave applications) is debuting an expanded portfolio of optoelectronics and photonic solutions.
MACOM’s complete portfolio includes high-performance modulator drivers, transimpedance amplifiers, clock/data recovery circuits, crosspoints, avalanche photodiodes (APD), PIN photodiodes, Fabry-Perot (FP) and distributed feedback (DFB) lasers, silicon photonics, 53Gbaud PAM-4 physical layer devices (PHYs) and receiver optical sub-assemblies (ROSAs) and transmitter optical sub-assemblies (TOSAs) for enterprise and telecom optical systems operating up to 100G, 400G and beyond.
Highlights in MACOM’s booth include:
- a 400G SR8 fully analog chipset solution for QSFP-DD applications (featuring MACOM’s CDR, TIA and driver);
- MACOM’s 100G CWDM4 L-PIC (laser photonic integrated circuit) solution;
- 400G-FR4, claimed to be the lowest-cost upgrade path for >100G throughput, featuring MACOM’s PAM-4 PHY, L-PIC and TOSA/ROSA;
- 5G optical connectivity solutions for SFP28 SR/LR/ER and 100G wireless chipsets;
- 2018 Lightwave Innovation Award Finalists: MATA-03819 four-channel 100G linear transimpedance amplifier (TIA) for 400G optical modules and PT-28E differential-output reference receiver module for 28/56 GB PAM-4 transmission receive applications.