26 February 2018
Cree signs $100m long-term deal to supply 150mm SiC wafers to Infineon
© Semiconductor Today Magazine / Juno PublishiPicture: Disco’s DAL7440 KABRA laser saw.
Cree Inc of Durham, NC, USA has signed a strategic long-term agreement (valued at well over $100m) to produce and supply its Wolfspeed 150mm silicon carbide (SiC) wafers to Infineon Technologies AG of Munich, Germany.
The supply of 150mm SiC wafers will enable Infineon to broaden its product offering to address high-growth markets, such as photovoltaic inverters, electro-mobility, robotics, charging infrastructure, industrial power supplies, traction and variable speed drives. Since Infineon has already converted all its SiC manufacturing lines to 150mm SiC wafers, the agreement covers only this wafer diameter.
“We have known Cree for a long time as a strong and reliable partner with an excellent industry reputation,” comments Infineon’s CEO Reinhard Ploss. “Based on the secured long-term supply of SiC wafers, we strengthen our strategic growth areas in automotive and industrial power control,” he adds.
“Infineon is a longstanding, valuable commercial partner with an excellent reputation,” says Cree’s CEO Gregg Lowe. “This agreement validates the quality of Cree’s SiC wafer technology and our capacity expansion, as well as the accelerated adoption of SiC-based solutions that are critical to enabling faster, smaller, lighter and more powerful electronic systems,” he adds.