26 February 2018
Anokiwave’s highlights strategy to enable roll-out of mmW 5G systems
© Semiconductor Today Magazine / Juno PublishiPicture: Disco’s DAL7440 KABRA laser saw.
Anokiwave Inc of San Diego, CA, USA – which provides highly integrated silicon core chips and III-V front-end integrated circuits for millimeter-wave (mmW) markets and active antenna-based solutions – says that, at the GSMA’s Mobile World Congress (MWC 2018) in Barcelona Spain (26 February – 1 March), its 5G ICs will power more than 10 customer 5G arrays at all three mmW 5G bands. In addition, more than 10 Anokiwave Active Antenna Innovator Kits, driven by the firm’s 5G ICs, are being featured at several partner booths.
As part of its strategy to enable mmW 5G systems by industrializing planar active antennas with silicon core ICs, Anokiwave has introduced silicon ICs at each of the major mmW bands - 26GHz, 28GHz and 39GHz. The AWMF-0108 IC (launched in 2016) operates at 26.5–29.5GHz, the AWMF-0123/5 ICs (launched in 2017) operate at 37.1–40GHz, and the AWMF-0135 (launched in 2017) operates at 24.25–27.5GHz. Each of the quad core ICs features embedded functions for remote telemetry and low-latency steering.
To demonstrate the performance achievable using low-power silicon integration and efficient antenna layout and design, Anokiwave and its partner Ball Aerospace have introduced a family of Active Antenna Innovator Kits at 26GHz and 28GHz. The 64- and 256-element active antennas show how 5G coverage can be rolled out by network operators using the mmW bands, with low power footprint and high energy efficiency, while meeting key operating specifications for data rate, latency, coverage and reliability.
“As 5G wireless network deployments are expected worldwide as early as 2018, Anokiwave stands ready to equip service providers and OEMs with innovative ICs in large volumes for all major 5G mmW bands,” says CEO Robert Donahue.