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5 April 2018

Plasma-Therm acquires KOBUS, expanding plasma deposition portfolio

© Semiconductor Today Magazine / Juno PublishiPicture: Disco’s DAL7440 KABRA laser saw.

Plasma-Therm LLC of St Petersburg, FL, USA (which makes plasma etch, deposition and advanced packaging equipment for specialty semiconductor and nanotechnology markets) has acquired plasma deposition company KOBUS of Montbonnot, France, which enables FAST (Fast Atomic Sequential Technology), an alternative to atomic layer deposition (ALD) where thick and conformal films are required.

As a unique deposition method at the intersection between ALD and CVD, FAST is enabled by a proprietary chemical vapor deposition (CVD) reactor design combined with pulsing capability and, while capable of depositing in traditional ALD mode, it is optimal for thick and conformal layer deposition and offers new solutions for 3D integration challenges, Plasma-Therm says.

KOBUS offers a unique portfolio of equipment for both mature and advanced materials deposition, expanding Plasma-Therm’s plasma-based deposition and etch suite of products for all silicon and emerging compound semiconductor applications.

Plasma-Therm reckons that the acquisition will allow it to establish a solid base in Europe and conduct R&D development in Grenoble’s ‘Silicon Valley’, a region fueled with R&D, startups and large semiconductor corporations.

Tags: Plasma-Therm

Visit: www.kobus-tech.com/technologies/fast

Visit: www.plasmatherm.com

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