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22 March 2017

MACOM launches 100G CWDM4 transmitter L-PIC chipset for 400G for cloud data centers

MACOM Technology Solutions Inc of Lowell, MA, USA (which makes semiconductors, components and subassemblies for analog RF, microwave, millimeter-wave and photonic applications) has announced the production-ready MAOP-L284CN, its 100G CWDM4 transmitter L-PIC (Lasers integrated with a Silicon Photonic Integrated Circuit) and supporting driver and controller IC chipset.

To meet the bandwidth demands, resiliency and data redundancy requirements of existing cloud data centers, data-center optical interconnects are transitioning from 100G to 400G, driving explosive demand for high-speed optical links, says the firm.

The demonstration shows the platform’s PAM-4 CWDM4 capability of uncooled operation at 400G at distances up to 2km on single-mode fiber. The devices leverage key MACOM technologies optimized for high-port density applications in cloud data-center applications. The demonstration will transmit 100G PAM-4 over a single lambda with the L-PIC platform at the Optical Fiber Communication conference & exposition (OFC 2017) in Los Angeles (21-23 March). 

“We have moved quickly to leverage the proven success achieved with EFT [etched facet technology] lasers to other platforms. Using EFT, we enabled the seamless integration of the TOSA optical path including lasers, monitor diodes, modulators and multiplexers onto a single chip, yielding the industry’s first silicon photonic integrated circuit (PIC) integrated with self-aligning lasers (L-PIC) for 100G,” says Arlen Martin, director of product marketing, Silicon PICs, Lightwave Networking Components, at MACOM. “By solving the key challenge of aligning lasers to the silicon PIC, maintaining high yield and high coupling efficiency, MACOM is making the adoption of silicon PICs a reality for the high-speed, high-density optical interconnects demanded by cloud data-centers OEMs.”

The L-PIC device combines four distributed feedback (DFB) laser diodes using MACOM’s patented EFT, four 28G Mach-Zehnder optical modulators integrated with a coarse wavelength division multiplexer (CWDM), monitor photodiodes and a high-performance output coupler for operation on one standard single-mode fiber. Using MACOM’s patented self-aligning etched facet technology (SAEFT) for precision attachment of the lasers to the SiPh L-PIC, the device enables customers to bypass optimizing optical coupling with active alignment and curing, offering instead an integrated single device that reduces manufacturer assembly time and component cost.

The MAOP-L284CN L-PIC transmitter is available as part of a complete MACOM chipset platform, including the MAMF-011095 silicon PIC controller and the MASC-37053A high-speed, low-power modulator driver. Optimized to work together, this chipset offers improved performance, eliminates the need for assembly of discrete components, reduces configuration and test costs, and accelerates time to market. With the recent acquisition of Applied Micro Circuits Corp (AMCC) of Santa Clara, CA, USA and its PAM-4 technology, MACOM is extending its L-PIC transmitter platform to support 200G and 400G switch-to-fiber applications.

MACOM is featuring demonstrations of its L-PIC based CWDM4 chipset solution and 100G over a PAM-4 single lambda on the L-PIC platform in booth #1736 at the Optical Fiber Communications conference & exhibition (OFC 2017) in Los Angeles (21-23 March).

See related items:

MACOM completes acquisition of AppliedMicro

Tags: M/A-COM

Visit: www.ofcconference.org

Visit: www.macom.com

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