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30 January 2017

Hitachi High-Tech and Picosun collaborating on plasma-enhanced ALD

Hitachi High-Technologies Corp of Tokyo, Japan and Picosun Oy of Espoo, Finland have announced a technical cooperation on plasma-enhanced atomic layer deposition (PE-ALD) to advance thin-film coating using their jointly developed microwave electron cyclotron resonance (ECR) ALD technology.

In the PE-ALD reactor, Hitachi High-Tech's ECR plasma generator is integrated with Picosun's industry-proven, digitally controlled ALD system. The firms say that the quality of the deposited materials is consequently substantially better, and claim that the deposition process is more precise than existing traditional ALD and plasma-enhanced ALD methods.

The firms add that superior results for various nitride and oxide films have already been confirmed on 300mm wafers, and other process applications are under evaluation.

See related items:

Picosun providing production‐scale AlN batch process, targeting power electronics applications

Picosun launches 150-200mm wafer batch ALD system for LEDs, MEMS and power devices

Tags: ALD

Visit: www.picosun.com

Visit: www.hitachi-hightech.com/global

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