, MRSI launches high-speed die bonder for photonics high-volume manufacturing

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IQE

21 August 2017

MRSI launches high-speed die bonder for photonics high-volume manufacturing

MRSI Systems of North Billerica, MA, USA, which manufactures fully automated, high-precision die bonding and epoxy dispensing systems, has launched the MRSI-HVM3 high-speed die bonder to support high-volume manufacturing requirements for photonics applications. The MRSI-HVM3 is in full production and shipping to customers worldwide.

Users need to scale up manufacturing to unprecedented levels for advanced applications such as data centers, telecom upgrades to 100G+, 5G wireless, the Internet of Things (IoT), and advanced optical sensors. High-volume manufacturing of photonic, sensor, and semiconductor devices now demands a die bonding system that can deliver high speed without sacrificing precision and flexibility, says the firm. The MRSI-HVM3 high-speed, flexible 3μm die bonder has been built to address this challenge. The new system leverages a well-defined set of MRSI's core competences, built up over 30 years, in system design, software development, machine vision, motion control, industrial automation, and process solutions.

“The new MRSI-HVM3 incorporates the latest hardware and software innovations,” notes Dr Yi Qian, VP of product management. “Equipped with ultrafast-ramp eutectic stations, it deploys multiple levels of parallel processing utilizing dual gantries, dual heads, dual bonding stages, and ‘on-the-fly’ tool changes,” he adds. “Used across all products, MRSI's platform software makes it easy for users to change process settings on their own for new parts, new processes, and new products. These features provide our customers with best-in-class throughput for capacity expansion; high accuracy for high-density packaging; and unmatched flexibility for multi-chip multi-process production in one machine,” Qian claims. The MRSI-HVM3 high-speed die bonder supports applications including chip-on-carrier (CoC), chip-on-submount (CoS), and chip-on-baseplate or board (CoB).

At the 19th China International Optoelectronic Exposition (CIOE 2017) in Shenzhen (6-9 September), MRSI is exhibiting with its Chinese representative CYCAD Century Science and Technology (in booth #1C66), including private demonstrations of the MRSI-HVM3 performing CoC eutectic and epoxy bonding.

Tags: Die Bonder

Visit: www.cioe.cn/en

Visit: www.mrsisystems.com

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