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19 February 2016

MACOM debuting new GaN power transistors for macro base-stations among expanded wireless infrastructure at Mobile World Congress

At the Mobile World Congress (MWC 2016) in Barcelona, Spain (22–25 February), M/A-COM Technology Solutions Inc of Lowell, MA, USA (which makes semiconductors, components and subassemblies for analog RF, microwave, millimeter-wave and photonic applications) is debuting a newly expanded portfolio of wireless infrastructure semiconductor solutions which, optimized to meet the most demanding bandwidth, performance and efficiency needs, target new standards for integration, ease of use and cost effectiveness. 

MACOM's technology and wireless application experience enables mobile network operators worldwide to keep pace with burgeoning bandwidth demands while minimizing capital and operating expenses, says Preet Virk, MACOM's senior VP & general manager, Carrier Networks. "Addressing the needs of 4G, 4.5G and 5G wireless infrastructure, with the proven ability to support high-frequency backhaul and access technologies, MACOM provides a one-stop shop for high-performance RF, microwave, millimetre-wave and optical components," he adds. 

Solutions and technologies for wireless network infrastructure that MACOM is exhibiting include the following:

  • The new MAGb series of GaN power transistors for macro base-stations (being debuted at MWC) produce GaN performance at what is claimed to be LDMOS-like cost structures at scaled volume production levels. MAGb power transistors target all major cellular bands within the 1.8-3.8GHz frequency range, and support peak output power up to 700W.
  • MACOM's small-signal solutions for base-station receivers span from discrete high-power switch, low-noise amplifier (LNA), digital step attenuators, variable voltage attenuators and control components to semi- and fully integrated front-end modules that combine these devices with optional bias and matching capabilities. These highly integrated modules are ultra-compact and easy to use, and provide a wide range of customization and scalability options.
  • The newest entries in MACOM's family of gallium arsenide (GaAs) microwave power amplifiers (PAs) for wireless backhaul applications enable full frequency-band coverage from 7GHz to 86GHz, with narrow and wideband PA options to ensure deployment flexibility.
  • MACOM's family of E-band PAs and integrated modules help to accelerate the evolution to higher-capacity wireless backhaul, while its surface-mountable E-band Tx and Rx modules simplify the design and manufacturing of low-cost E-band point-to-point radios.
  • MACOM is aiding the development of next-generation 5G and MIMO demonstration systems, through its decades of experience in mmWave and expertise from the circuit level to the device packaging level, as well as phased array technologies. Providing the ability to integrate multiple components into ultra-compact front-end modules, MACOM says that it can help to facilitate the design of large antennae arrays supporting advanced 5G beam-forming capabilities.
  • Regarding optical transport components, MACOM also offers a portfolio of optical front-haul (CPRI) and optical back-haul (GPON) lasers and chipsets to complement its RF and microwave product portfolio for wireless infrastructure.

Tags: M/A-COM

Visit: www.macom.com/wirelessinfra

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