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IQE

24 September 2014

Plessey adds in-house GaN-on-Si LED assembly line

UK-based Plessey has announced a further move to aligning operations to its expanding facility in Plymouth by adding an LED assembly line. The line should enable the firm to focus on its high-brightness LED growth plans based around its solid-state lighting and sensing business, taking new products from concept to production in less time while also functioning as an innovation center for the next generation of LED packages.

The assembly line uses a laser saw process and finishes with an automatic test for industry-standard PLCC (plastic, leadless chip carrier) packages. It includes die attach, wire bonding, phosphor mixing, encapsulation and singulation, in addition to all the other industry-standard, supporting equipment and processes. Designed specifically around speed and flexibility, the line will provide engineering samples for customer evaluation and pilot builds ahead of full production.

“The industrialization of GaN-on-silicon LED technology does not end at producing wafers - it also requires as much attention to the back-end processing to ensure that all the benefits we make at wafer level are fully realized in the final product,” says Plessey’s operations director Mike Snaith. “This is the best way to provide customers with the LED products they need.”

Plessey says that its Plymouth facility is already demonstrating returns for this transition, enabling it to build working samples of complete in-house filament prototypes for the new market of LED filament replacement bulbs. The filament prototypes use dedicated die and assembly, all of which is designed and manufactured within the facility.

“The fact that we are recruiting recognized industry shapers from the world of solid-state lighting is a tangible endorsement that the Plessey value proposition is both exciting and credible,” reckons chief technology officer Dr Keith Strickland.

The firm says that the facility brings additional benefits with wafer sawing and, going forward, new LED packaging standards will be established to match the benefits made at the wafer level. Plessey adds that the assembly line investment is the start of this cycle of innovation where a revision of the value chain for LEDs and solid-state lighting is taking place.

Plessey’s range of products for lighting applications will be showcased in stand D31 at the LuxLive event at ExCel London, UK (19-20 November).

Tags: Plessey GaN-on-Si HB-LEDs

Visit: www.plesseysemiconductors.com/led-plessey-semiconductors.php

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