Temescal

Semigas

CLICK HERE: free registration for Semiconductor Today and Semiconductor Today ASIACLICK HERE: free registration for Semiconductor Today and Semiconductor Today ASIA

Join our LinkedIn group!

Follow ST on Twitter

IQE

2 June 2014

AWR and ANSYS partner to bring HFSS into Microwave Office

AWR Corp of El Segundo, CA, USA (a National Instruments Company), which supplies electronic design automation (EDA) software for RF and high-frequency components and systems, and engineering simulation software provider ANSYS Inc of Canonsburg, south of Pittsburgh, PA, USA have integrated ANSYS HFSS into AWR’s Microwave Office high-frequency circuit design software. This integration unites the industry standard for full-wave electromagnetic (EM) field simulation and NI AWR Design Environment/Microwave Office to quickly and accurately simulate microwave circuits.

With this design flow, Microwave Office users can access HFSS for the analysis of EM fields and coupling of 3D structures such as passive components, bumps, bond wires, and pins, which are essential for designing and realizing microwave circuits like monolithic microwave integrated circuits (MMICs), densely populated RF circuit boards and multi-function modules.

The link between the two software tools is leveraged from AWR’s EM Socket open-standard interface, which enables AWR users to access a broad range of electromagnetic (EM) tools from within the Microwave Office design environment. The EM Socket architecture also allows AWR Microwave Office users to essentially simulate EM structures with a single mouse click using either AWR’s AXIEM 3D planar method of moments solver or Analyst 3D finite-element method EM software.

In addition to enabling ANSYS HFSS 3D EM simulation capabilities from within the NI/AWR Design Environment, the connection allows the resulting 3D layered format exported from the EM Socket interface to connect to the ANSYS multi-physics portfolio, which includes SIwave for signal/power integrity analysis and Icepak for thermal characterization.

“Collaborating with third-party firms to expand both the breadth and depth of technology available within the NI AWR Design Environment has been a mainstay of our product offering,” says AWR’s VP of marketing Sherry Hess.

A joint talk ‘A Streamlined Design Flow Featuring AWR Microwave Office and ANSYS HFSS’ is being presented at 11:10am ET on 3 June in the MicroApp Theater at the IEEE MTT-S International Microwave Symposium (IMS 2014) in Tampa, FL, USA, where AWR is exhibiting in booth #633 and Ansys is exhibiting in booth #1433.

Tags: AWR EDA

Visit: www.awrcorp.com

Visit: www.ansys.com

Share/Save/Bookmark
See Latest IssueRSS Feed

AXT