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16 July 2014

Mitsubishi Electric launches super-mini full-SiC DIPPFC module

Tokyo-based Mitsubishi Electric Corp has launched a transfer-molded super-mini dual in-line package power factor correction (DIPPFC) module incorporating silicon carbide (SiC) transistors and diodes that is expected to help reduce the power consumption and size of home appliances. The new 20Arms/600V PSF20L91A6-A module will be exhibited at MOTORTECH JAPAN 2014 during the TECHNO-FRONTIER 2014 event at Tokyo Big Sight in Japan (23-25 July).

Built-in chips include a PFC circuit comprising two SiC metal-oxide semiconductor field-effect transistors (MOSFETs), two SiC Schottky-barrier diodes (SBDs) and one LVIC chip. Other functions include short-circuit protection (using external shunt resistor) and a control power supply under-voltage (UV) protection (Fo output on N-side protection).

Mitsubishi Electric notes that SiC contributes to both lower power consumption and compact size:

  • Power loss is reduced by about 45% compared to silicon products, contributing to improved energy conversion.
  • The SiC Schottky-barrier diode (SBD) reduces recovery current power consumption and electromagnetic interference (EMI) noise.
  • The SiC metal-oxide semiconductor field-effect transistor (MOSFET) achieves maximum 40kHz high-frequency switching and contributes to the downsizing of peripheral components, such as reactors and heat-sinks.
  • Power factor correction (PFC) and a driving IC contribute to downsizing by reducing the mounting surface area and simplifying wiring.

Mitsubishi Electric also notes a simplified design for inverter systems:

  • Adoption of the same 24.0mm x 38.0mm x 3.5mm package as the dual in-line package intelligent power module (DIPIPM) simplifies the installation of heat-sinks.
  • The interleave method for PFC decreases the ripple current and simplifies the noise filter circuit.

MitsubishiPicture: Full-SiC DIPPFC for home appliances.

Mitsubishi Electric commercialized its first DIPIPM transfer-molded intelligent power module in 1997 and over the years has contributed to miniaturization and energy-savings in inverter systems. The technology has gained increased importance because annual power consumption has become an important index of energy savings in consumer appliances, such as air conditioners, says the firm.

The new full-SiC DIPPFC module is compliant with the Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment (RoHS).

Development of the DIPPFC module was partially supported by Japan’s New Energy and Industrial Technology Development Organization (NEDO).

Tags: Mitsubishi Electric SiC power modules SiC

Visit: www.MitsubishiElectric.com

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