- News
28 January 2014
PLD/MBE m-plane gallium nitride on lithium gallate
South China University of Technology has improved the quality of non-polar m-plane nitride semiconductor layers on lithium gallate (LiGaO2) by combining pulsed laser (PLD) and molecular beam epitaxy (MBE) deposition techniques [Weijia Yang et al, J. Mater. Chem. C, vol2, p801, 2014].
Non-polar nitride semiconductors are of interest for producing higher internal quantum efficiency (IQE) and hence more efficient light-emitting devices. However, the growth of non-polar material is difficult to achieve with sufficient quality or at low cost.
LiGaO2 (100) is an attractive substrate for m-plane gallium nitride (GaN) deposition because it has a lattice mismatch as small as 0.1%. Also, the thermal expansion coefficient is more nearly matching, compared with alternatives. Thermal expansion mismatch creates problems in processes involving temperatures up to 1000°C.
One drawback with LiGaO2 is that the lithium component tends to evaporate at raised temperature, as needed for MBE or metal-organic chemical vapor deposition (MOCVD).
PLD has been used to grow m-plane GaN at relatively low temperature, avoiding lithium evaporation, but the quality of the resulting material has not been sufficient for applications such as light-emitting diodes (LEDs) or laser diodes (LDs).
The researchers have designed a tool that allowed both PLD and MBE to be carried out in one ultrahigh-vacuum chamber. The system had access to gallium and indium MBE sources, along with a liquid gallium PLD target. The laser source was an external 248nm-wavelength krypton fluoride excimer laser focused through optical lenses on the target.
The LiGaO2 wafer was first annealed at 1000°C for 4 hours and cleaned to give an atomically flat surface free of contamination. After putting the wafer in the vacuum chamber and pumped down to 5x10-11Torr, the laser was used to ablate Ga with 220mJ pulses at 20Hz frequency. The substrate was positioned 5cm away and heated to 200°C. For the nitrogen source, N2 gas was pumped in at 6x10-3Torr pressure and put through a purifier and a 500W radio-frequency plasma radical generator.
The PLD was used to grown 50nm of m-plane GaN as a template for further GaN layers: 300nm through 500°C MBE, and 2μm through 750°C MBE.
The GaN(1100) x-ray rocking curves show improved crystallinity in the upper layers, as indicated by narrower full-width at half maximum (FWHM) values: 0.55° for the PLD layer, 0.14° for the 500°C MBE, and 0.098° for the final 2μm layer. These values compare very favorably with the 0.25° previously achieved in a PLD-only approach.
 Figure 1: Schematic structure of InGaN/GaN MQWs grown on LiGaO2(100) substrates.
Figure 1: Schematic structure of InGaN/GaN MQWs grown on LiGaO2(100) substrates.
The PLD/MBE layers are estimated to have dislocation densities of 1.6x1010/cm2, 1.1x109/cm2, and 5.1x108/cm2, respectively.
The researchers checked that no lithium diffused from the substrate into the overlying GaN layer with x-ray photo-electron spectroscopy (XPS) that showed the initial low-temperature m-plane GaN buffer had suppressed Li diffusion from the substrate.
To demonstrate the possibilities for LED production, the researchers added a 7-period InGaN/GaN (3nm/12nm) multiple quantum well (MQW) structure with 700°C MBE (Figure 1). The indium composition of the wells was 0.156. The InGaN layers were estimated to have a dislocation density of 6.6x108/cm2, on the basis of an x-ray rocking curve FWHM of 0.11°.

Figure 2: Room-temperature photoluminescence spectrum of non-polar m-plane InGaN/GaN MQWs on LiGaO2 substrate.
Photoluminescence measurements gave a peak at 445nm and a FWHM of 22nm (Figure 2), “comparable to the commercially available LEDs and semi-polar InGaN/GaN LEDs”, according to the researchers.
LEDs Semi-polar LEDs LDs InGaN GaN MQW MBE
http://dx.doi.org/10.1039/C3TC31935K
The author Mike Cooke is a freelance technology journalist who has worked in the semiconductor and advanced technology sectors since 1997.
 
    














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    Juno Publishing and Media Solutions Ltd. All rights reserved. Semiconductor
    Today and the editorial material contained within it and related media is
    the copyright of Juno Publishing and Media Solutions Ltd. Reproduction in
    whole or part without permission from Juno Publishing and Media Solutions
    Ltd is forbidden. In most cases, permission will be granted, if the magazine
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