Temescal

Semigas

CLICK HERE: free registration for Semiconductor Today and Semiconductor Today ASIACLICK HERE: free registration for Semiconductor Today and Semiconductor Today ASIA

Join our LinkedIn group!

Follow ST on Twitter

IQE

14 February 2014

Evatec enhances GaAs PVD processing capabilities in US fab

Evatec Ltd of Flums, Switzerland, which makes thin-film deposition and etch processing equipment for semiconductor, MEMS, optical and optoelectronic applications, has delivered multiple RADIANCE cluster sputter tools to a major US gallium arsenide (GaAs) fab supplying products to the RF industry.

The tools support expansion of the fab’s 6” GaAs production requirements, enabling implementation of new bump metallization and high-fill-ratio barrier layer processes leading to significant cost savings. Evatec says that it was chosen for its high throughput and superior process stability, leading to increased yield and reliability performance.

RADIANCE is a sputter tool that can be configured for multiple technologies on a single platform. ‘Single’ process modules can be configured for physical vapor deposition (PVD), plasma-enhanced chemical vapor deposition (PECVD) or inductively coupled plasma (ICP) etch, whilst a six-process-position ‘BATCH’ module can be equipped for sputter and etch processes, allowing for in-situ processes on the same platform.

The RADIANCE flexibility - combined with process knobs such as substrate rotation, target-to-substrate distance and in-situ metrology capabilities such as optical monitoring - makes the tool a suitable choice for development and production facilities across a wide range of market applications from compound semiconductors to optoelectronic applications, says Evatec.

Tags: Evatec Sputtering PVD PECVD Etch

Visit: www.evatecnet.com

Share/Save/Bookmark
See Latest IssueRSS Feed

AXT