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13 September 2013

Microsemi launches 750W GaN-on-SiC RF power transistor for aviation applications

Microsemi Corp of Aliso Viejo, CA, USA (which designs and makes analog and RF devices, mixed-signal integrated circuits and subsystems) has expanded its family of radio-frequency power transistors based on gallium nitride (GaN) high-electron-mobility transistor (HEMT) on silicon carbide (SiC) technology with a new 750W RF transistor. The MDSGN-750ELMV can be used in a full range of air-traffic control and collision avoidance equipment. Targeted applications include commercial secondary surveillance radar (SSR), which is used globally to interrogate and identify aircraft in airport locales and regional centers within about a 200 mile range.

The MDSGN-750ELMV delivers 750W of peak power with 17.2dB of power gain and typical 70% drain efficiency when operating at 1030/1090MHz, providing what is claimed to be the most power in one single-ended device of its type covering this band. The single-ended design with simplified impedance matching replaces lower-power devices that require additional levels of combining. A single output stage pair provides 1.5kW of peak output power with margin, while combining four output stage pairs delivers a full system >5kW peak output power.

In addition, the new RF device is capable of handling the demanding commercial Mode-S ELM (Extended Length Message) pulsing conditions for both the 1030MHz ground-based interrogators and 1090MHz airborne transponders and can be used in the output stage of high-performance ground. ELM makes air travel safer by facilitating the communication of shared weather and air-traffic situational awareness information to aircraft within a regional locale. It is also suitable for use in commercial air-to-air traffic alert and collision avoidance systems (TCAS) and in IFF (Identify Friend or Foe) systems, which are essential in protecting friendly aircraft within a specific area.

The MDSGN-750ELMV is offered in a single-ended package and is fabricated with 100% high-temperature gold (Au) metallization and wires in a hermetically solder-sealed package for long-term reliability. Loaner demonstration units are available to qualified customers.

Tags: Microsemi


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