20 November 2013
Picosun launches 150-200mm wafer batch ALD system for LEDs, MEMS and power devices
Atomic layer deposition (ALD) equipment maker Picosun Oy of Espoo, Finland has launched the P-200 batch ALD system, specifically optimized for fast and efficient manufacturing of MEMS (micro-electro-mechanical systems, e.g. sensors and actuators), LEDs, and power electronics components.
The P-200 ALD tool is designed for 150mm- or 200mm-diameter wafers in batches of 25. Picosun says that the cornerstones of its ALD system design - unmatched versatility, modularity and flexibility - are manifested in the variety of automation options available for the P-200: The system can be equipped with a linear inline loader, operated with an industrial robot, connected to a vacuum robot, or integrated with a vacuum load lock, glove box or mini clean environment. Quick, fully automated batch processing enables high production throughput with proven process quality and low cost-of-ownership, claims the firm.
The P-200 ALD system has already been accepted by two production customers for MEMS and selected by two prominent LED makers, says Picosun. With the P-300 and P-1000 ALD systems launched previously, Picosun now offers a full range of industrial batch production tools to suit every size of wafer and production volume.
“The compact, small-footprint design of the tool, combined with extremely fast batch processing and excellent film quality, give us an unrivaled competitive edge,” reckons managing director Juhana Kostamo.