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10 July 2013

Leti and EVG launch common lab on wafer bonding technologies

Micro/nanotechnology R&D center CEA-Leti in Grenoble, France and EV Group (EVG) of St Florian, Austria, a supplier of wafer bonding and lithography equipment for the MEMS (micro-electro-mechanical system), nanotechnology and semiconductor markets, have launched a three-year common lab to optimize temporary- and permanent-bonding technologies related to 3D TSV (through-silicon via) integration and all direct bonding heterostructures.

The lab, which continues more than 10 years of collaboration between the two organizations, is focusing on hardware, software and process development.

“Temporary- and permanent-bonding equipment and process solutions are key product offerings for EVG,” says Markus Wimplinger, EVG’s corporate technology development & IP director. “This project leverages CEA-Leti’s global leadership in wafer-bonding research and EVG’s unparalleled expertise in developing wafer bonding equipment and process technology,” he adds.

“Like all common labs that Leti creates with its partners, this project is designed to produce specific, practical solutions that address current and future market requirements,” notes CEA-Leti’s CEO Laurent Malier. “This collaboration is targeting results that will make 3D TSV integration more efficient and cost effective and open new areas of wafer bonding using covalent bonding at room temperature,” he adds.

“Bringing these approaches to high-volume manufacturing with reliable wafer bonding requires innovative fabrication processes,” says Fabrice Geiger, head of Leti’s Silicon Technology division. “The new equipment and process technology developed within the common lab will allow exciting possibilities, especially for heterogeneous materials stacks, that require very low-temperature wafer bonding.”

See related items:

Fraunhofer ISE teams with EVG to enable direct wafer bonding for next-gen solar cells

EVG extends wafer bonding equipment and process solutions for covalent bonding technology

Tags: EVG Leti



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