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14 February 2013

Philips launches die-level LUXEON Flip Chip LEDs for greater luminaire design flexibility

Philips Lumileds of San Jose, CA, USA has launched new LUXEON Flip Chip LED devices (in a 1mm x 1mm format) to provide luminaire manufacturers with more design flexibility. Users can now access Lumileds technology through a robust LUXEON Flip Chip die format, giving them greater design options than previously.

“Now luminaire manufacturers can enjoy the best of both worlds, by either incorporating packaged LEDs as they did in the past, or by starting with the LED die and customizing the phosphor and packaging to best suit their lighting application,” says CEO Pierre-Yves Lesaicherre.

While traditional wire bonding limits the packing and power density of LEDs, LUXEON Flip Chip LEDs can be packaged closer and can be driven at a higher current density. This requires fewer emitters to achieve a higher lumen output at higher lumen densities, a capability that is especially advantageous with chip-on-board (COB) and other high-power applications.

“The end result is that luminaire manufacturers can achieve higher lumens per dollar through higher lumen densities and a straightforward packaging process,” says Lesaicherre.

Tags: Lumileds


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