7 August 2013

RFaxis begins volume production of single-chip Wi-Fi/Bluetooth RF front-end IC

Fabless semiconductor firm RFaxis Inc of Irvine, CA, USA, which designs RF semiconductors and embedded antenna solutions for the wireless connectivity and cellular mobility markets, has begun volume production of RFX8422S, which is claimed to be the first single-chip/single-die Wi-Fi/Bluetooth combo RF front-end IC (RFeIC) in pure CMOS. Also, RFaxis has started sampling its RFX8422, a drop-in replacement of RFX8422S, for applications that require a reduced maximum package height of 0.4mm.

“RFaxis is launching new Wi-Fi/Bluetooth RF front-end solutions at price points never heard of until now," reckons chairman & CEO Mike Neshat.

The RFX8422S and RFX8422 RFeICs provide key RF functions for dual-mode Wi-Fi/Bluetooth operation in a typical smartphone or other mobile devices. Both parts include a high-efficiency linear power amplifier (PA), low-noise amplifier (LNA) and single-pole triple-throw (SP3T) antenna switch, all integrated into a monolithic die, and are offered in an ultra-compact 2.5mm x 2.5mm 16-pin quad-flat no-lead (QFN) package. Developed and manufactured in the industry’s most cost-effective bulk CMOS process, the RFX8422S and RFX8422 family of complete ‘3-in-1’ RFeICs are pin-compatible with similar offerings from competitors currently on the market.

“By taking full advantage of the cost-effectiveness of CMOS, we can now offer complete Wi-Fi/Bluetooth combo 3-in-1 RFeICs at lower prices than the existing 2-in-1 solutions with far less functionality from competitors,” claims Neshat. “Due to cost/price considerations, our competitors’ 2-in-1 offerings only provide the LNA and SP3T switch, and are lacking the PA, which is most critical for extending the operating range of a wireless device,” he adds.

Tags: RFaxis CMOS

Visit: www.rfaxis.com