5 December 2011

Brewer Science and SÜSS MicroTec jointly commercialize ZoneBOND technology for thin wafer handling

Brewer Science Inc of Rolla, MO, USA (which provides specialty materials and equipment for the microelectronics industry), and equipment and process solutions provider SÜSS MicroTec AG of Garching, near Munich, Germany, are joining forces in commercializing ZoneBOND technology for thin wafer handling.

SÜSS MicroTec, which provides room-temperature debonding process equipment, is now offering the Brewer Science ZoneBOND process on the XBC300 and XBS300 platforms, targeted for high-volume bonding and debonding of 200/300mm wafers using silicon or glass carriers.

Brewer Science offers products specifically designed for the implementation of the ZoneBOND process including materials for carrier preparation, adhesives, removers, as well as small-scale debonding equipment.

ZoneBOND technology is a solution for wafer handling that provides what is claimed to be excellent total thickness variation (TTV) control, high-temperature stability, and low-stress debonding. Users can benefit through higher yield at debonding, higher throughput, and lower cost of ownership.

The joint effort between Brewer Science and SÜSS MicroTec combines both firms’ expertise to provide a complete material, equipment and process solution, optimized for each customer’s process needs, the companies add.

Tags: Brewer Science SUSS MicroTec Wafer handling

Visit: www.suss.com

Visit: www.brewerscience.com/products/temporary-bonding-materials/zonebond