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JP Sercel Associates Inc (JPSA) of Manchester, NH, USA, which makes laser scribing and laser lift-off (LLO) systems for LED production, says that its shipments of laser processing systems for LEDs for the first three quarters of 2010 are up 250% year-on-year, with increasing demand for high-throughput 266nm front-side scribing tools for sapphire and high-brightness (HB) LED wafers being driven mainly by major Taiwanese and Korean manufacturers.
“Our 266nm front-side scribing continues to dominate the market because we are able to provide LED manufacturers higher-throughput systems that enable more die to be packed onto each wafer,” claims founder & chief technical officer Jeffrey Sercel. “The increased die density and reduced damage from the laser scribing produces significantly higher yields than mechanical or saw dicing methods,” he adds. “To maintain our strong market presence, we continue to develop advanced processes in both scribing and laser lift-off applications.”
JPSA’s recently released automation platform for the IX 6100 laser scribing and laser lift-off systems is currently shipping to LED makers. The new IAP (Integrated Automation Platform) wafer load and unload automation module provides dual-cassette wafer ports, further streamlining the manufacturing process and increasing yields.
For continued development of micromachining processes and production space, JPSA is in the final stages of expanding its headquarters, providing cleanrooms, R&D laboratories, and office space to accommodate the growing customer service and engineering teams. Completion is scheduled for October.
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