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Skyworks Solutions Inc of Woburn, MA, USA, which makes linear products, power amplifiers, front-end modules and radio solutions for handset and infrastructure equipment, has introduced five small, low-profile 3mm x 3mm x 0.9mm power amplifier modules (PAMs) with an integrated daisy chain directional coupler for next-generation platforms, eliminating the need for any external coupler.
The single gallium arsenide monolithic microwave integrated circuit (MMIC) contains all active circuitry in the module, including on-board bias circuitry as well as input and inter-stage matching circuits. Output match into a 50-ohm load is realized off-chip within the module package to optimize efficiency and power performance.
The fully matched 10-pad surface-mount PAMs support all required modulations for a given frequency band, including CDMA, WCDMA and LTE handsets and datacards, as well as enabling a variety of compatible baseband/RF architectures. The modules meet the stringent spectral linearity requirements of high-speed downlink packet access (HSDPA), high-speed uplink packet access (HSUPA), and long-term evolution (LTE) data transmission with high power-added efficiency, says Skyworks.
Details of the five new power amplifier modules are as follows:
The PAMs are manufactured using Skyworks’ InGaP GaAs heterojunction bipolar transistor (HBT) BiFET process, which provides for all positive voltage DC supply operation while maintaining high efficiency and good linearity. Primary bias is supplied directly from any three-cell Ni-Cd, a single-cell Li-Ion, or other suitable battery with a low-voltage output of 3.2–4.2V. No VREF voltage is required. Power down is accomplished by setting the voltage on VENABLE to zero volts. No external supply-side switch is needed, as typical ‘off’ leakage is a few microamperes with full primary voltage supplied from the battery.