Company Profile: Logitech Ltd

 

Logitech Ltd design and manufacture precision bonding, cutting, lapping, polishing and CMP equipment.

Our specialist systems are typically used in the precision processing of semiconductor, laser, opto-electronic and fibre optic materials. Each of these industries benefit from the extremely high standards of material flatness and parallelism achieved when using Logitech machine / technology systems to provide high quality surfaces on:

• Semiconductor wafers such as Silicon, Gallium Arsenide and Indium Phosphide
• IC cross sections
• MEMS devices
• Optical components such as infra-red windows, micro-lenses and optical fibres
• Laser rods
• Photonic crystals and planks

Equipment

Logitech provide an entire range of materials processing equipment, from small bench-top R&D equipment, through to production level lapping and polishing systems. Our product range consists of the following equipment types:

• Lapping and Polishing
• Chemical Mechanical Polishing (CMP)
• Chemical Polishing
• Precision Saws
• Impregnation
• Bonding
• Test & Measurement
• Materials Processing Consumables

Product Focus

Logitech PM5 Precision Lapping and Polishing Machine

The PM5 is a single workstation machine, with integral abrasive autofeed system and automatic lapping plate flatness control. The PM5 range is a new generation of precision lapping and polishing machines offering significant refinements and benefits for all materials processing applications where there is a need for small vloume, R&D level processing throughput.

Logitech LP50 Precision Lapping and Polishing Machine

The LP50 provides an extremely precise, versatile lapping and polishing capability for production and research laboratories. With three workstations and a 355mm diameter plate, the LP50 can simultaneously accommodate up to three PLJ2, PP5 or PP6 jigs. Two PLJ7 jigs can be run simultaneously with the larger plate. The machine is thus able to provide the high volumes required in a production environment, while at the same time offering the
flexibility which is essential to the research-orientated laboratory.

Logitech CMP System (CDP)

The CDP Automatic system provides repeatable nanometer level accuracy for the majority of semiconductor materials used in current day device fabrication processes. Due to its accuracy, low cost of ownership and ease of use, it offers the idea environment for CMP and delayering applications. It is capable of working with wafers up to 300mm, MEMS devices or single IC. Optional End Point Detection ensures that the CDP provides repeatable,
accurate results whilst the low cost of ownership ensures that the CDP is
ideal for R&D use.

Logitech DH Polishing Systems

DH Polishing Systems provide automated final stage, high speed polishing of wafered materials or components. Time savings of up to 50% can be made when polishing filters, wedges, flats or even small LCD panels. Four motor driven, sweeping polishing heads allow up to 48 x 2" wafers to be polished at any one time, helping make the DH600 ideal for use in full production environments.

NGS automated Lapping System

The NGS is a precision lapping machine that incorporates high levels of automation to increase both production efficiency and product output. Available with the unique auto-lap feature, NGS is ideally suited to applications such as wafer backthinning and waveguide component manufacture. It allows up to 232 6” diameter silicon or III-V wafers to be lapped per week with a stock removal of 500 microns per wafer.

With a global network of appointed distributors, Logitech brings unsurpassed lapping and polishing technology and superior materials processing engineering to industries all over the world.

For more information on our cutting, lapping and polishing equipment and what Logitech technology will do for your business, call us on +44 (0)1389 875444 or complete our contact form.