Company Profile: EV Group (EVG)

EV Group (EVG): Equipment for the semiconductor industry

EV Group (EVG) is a renowned leader in complete process solutions in the fields of microsystems and nanotechnologies.

EVG is a technology and market leader for wafer processing equipment and has set worldwide industry standards with a comprehensive range of equipment.

The basis for our success is our products: lithography, bonding and imprint systems. We hold the dominant share of the market for all types of wafer bonding equipment and are the market and technology leader in lithography and nanoimprinting. Strong partnerships and our power of innovation form the basis for intelligent solutions built with the highest degrees of productivity and quality.

Headquartered in St. Florian, Austria, EV Group operates via a global customer support network, with subsidiaries in Tempe, Arizona; Albany, New York; Yokohama and Fukuoka, Japan and Chung-Li, Taiwan.

EVG Equipment

• IQ Aligner
• EVG540 Fully-Automated Wafer Bonding System
• EVG770 NIL Stepper
• EVG620 Precision Alignment System
• EVG6200 Infinity Double-Side Mask Aligner
• EVG810LT LowTemp Plasma Activation System
• EVG40 Top-to-Bottom Side Measurement System
• Gemini Automated Production Wafer Bonder

EVG Markets (http://www.evgroup.com/applications.asp)

• Nanotechnology  
• MEMS (Micro-Electro-Mechanical Systems)
• Advanced Packaging, 3D Interconnect  
• SOI (Silicon on Insulator)  
• Compound Semiconductor and Silicon-Based Power Devices

Products

Aligners

EVG's superior aligner design with bottom side alignment allows for structure on both sides of a wafer, which is a unique technique developed by EVG in 1985. Based on flexibility and modularity, our aligners satisfy most critical demands in all areas of single and double-side photolithography and precision wafer alignment. EVG aligners can be customized for manual, R&D applications and high volume production with fully- automated handling.

 

 

 

Wafer Bonders

With more than ten years of experience in developing automated precision aligned wafer bonding equipment, EVG has set industry standards in all areas. Various wafer bonding techniques including anodic, silicon fusion, SOI, and thermo compression bonding are covered by our wafer bonders. We maintain a consistent bond chamber design on all bonders to allow for an easy migration of processes from manual to pilot-line and volume production.

 

Nanoimprint Lithography

Nanoimprinting is a technique to produce uniformly imprinted, ultra-fine structures. EVG's hot embossing systems are designed to apply high vacuum and high contact force conditions for precision imprinting. UV-Nanoimprint lithography is supported on EVG's systems using customized tooling.

Integrated Systems

GEMINI and HERCULES are fully integrated and highly automated production systems for lithography and wafer bonding processes. A maximum level of automation and process integration opens the door to large-scale manufacturing and guarantees a proven transition of processes from R&D stage to production.

 

 

Customized Solutions

EV Group offers customized solutions for all markets to meet individual customer needs.

For more information, visit www.EVGroup.com and our EVG-TShop "Click, Stop - the new way to shop" www.EVGTShop.com.

Contact:

Clemens Schütte
Director Marketing and Communications
EV Group (EVG)
DI Erich Thallner Straße 1
A-4782 St.Florian/Inn
Austria
Phone: + 43 7712 5311 0
E-Mail: c.scheutte@evgroup.com