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26 September 2018

GlobalFoundries delivering 8SW RF SOI client chips on 300mm platform for next-gen mobile applications

© Semiconductor Today Magazine / Juno PublishiPicture: Disco’s DAL7440 KABRA laser saw.

At its annual Global Technology Conference (GTC), GlobalFoundries of Santa Clara, CA, USA (one of the world’s largest semiconductor foundries, with operations in Singapore, Germany and the USA) says that its mobile-optimized 8SW 300mm RF silicon-on-insulator (SOI) technology platform has been qualified and is in production. Several clients are currently engaged for this RF SOI process, tailored to accommodate aggressive LTE and sub-6GHz standards for front-end module (FEM) applications, including 5G Internet of Things (IoT), mobile device and wireless communications.

Leveraging the 300mm RF SOI process, 8SW delivers significant performance, integration and area advantages, with up to 70% power reduction and 20% smaller overall die size compared with the previous generation. GlobalFoundries says that the technology enables superior low-noise amplifiers (LNAs), switches and tuners by supplying higher voltage handling and a best-in-class on-resistance (Ron) and off-capacitance (Coff) for reduced insertion loss with high isolation. The optimized RF FEM platform helps designers to develop solutions that enable extremely fast downloads, higher-quality connections and reliable data connectivity for existing 4G/LTE Advanced operating frequencies and future sub-6GHz 5G mobile and wireless communication applications.

“GlobalFoundries has now delivered more than 40 billion RF SOI chips for the world’s smart devices, and this latest generation of RF SOI technology is another proof point that we’re poised to meet accelerating global demand for solutions that deliver seamless, reliable data connectivity everywhere,” says Christine Dunbar, vice president of the RF business unit. “The mobile market continues to favor RF SOI, and GlobalFoundries’ industry-leading 8SW process in 300mm manufacturing is specifically designed to help our clients take advantage of more frequency bands that will deliver ultra-reliable communications across high-band LTE and future 5G applications,” she adds.

“We are proud to support GF’s new advanced and differentiated 8SW technology on 300mm RF SOI substrates and to continue our long-term strategic engineering and manufacturing collaboration enabling next-generation connectivity solutions,” comments Dr Bernard Aspar, executive VP at engineered substrate supplier Soitec. “We are ready to deliver the 300mm RF SOI substrates in high volumes to meet GF clients' growing market demands,” he adds.

“SEH believes 300mm RF SOI products are an important technology, whose time has come,” comments Nobuhiko Noto, general manager of SOI Division at Japan’s Shin-Etsu Handotai (SHE). “SEH has been a long-time partner on RF technology and looks forward to supporting GF for their future generations of RF technologies as well. We will continue to be a supplier to the 300mm RF SOI market as it grows.”

GlobalFoundries’ manufacturing legacy and deep technical expertise in RF SOI process has resulted in more than 40 billion RF SOI chips shipped for next-generation RF-enabled devices.

The 8SW technology is manufactured on GlobalFoundries’ 300mm production line at Fab 10 in East Fishkill, NY, USA, enabling clients to take advantage of advanced tooling and processes for faster time-to-market with RF SOI. Qualified process design kits are available now.

See related items:

GlobalFoundries launches 8SW RF SOI process for next-gen mobile and 5G applications


Visit: www.globalfoundries.com

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