New MEMS White Paper

Download the latest Logitech white paper and learn more about MEMS processing technology and techniques

Download our CMP White Paper

FREE subscription
Subscribe for free to receive each issue of Semiconductor Today magazine and weekly news brief.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

News

8 March 2007

 

Mitsubishi sampling 10Gbps XFP module with power consumption cut to 2.5W

Tokyo-based Mitsubishi Electric Corp has started shipping samples of a new, 1550nm-wavelength 10Gbps transceiver module (for production from May) capable of optical communication transmission up to a distance of 40km. Chromatic dispersion is 800ps/nm (at 40km). The operating temperature ranges from –5C to +70C.

The 22.15mm x 77.9mm x 13.3mm MF-10KSXA-008ZA module complies with the 10Gbps Form-factor Pluggable Extended Multi-Source Agreement (XFP MSA) for small optical transceivers, using an XFP MSA 4.0 Serial Interface (XFI).

Power consumption has been reduced to just 2.5W (about 30% less than that of the previous model MF-10KSXB003, and the lowest in the industry, the firm claims). This has been done by using a light-modulated integrated laser (a semiconductor optical modulator and laser diode in one chip that has low wavelength fluctuation, even during high modulation). Reduced power consumption can allow increased functions per module, plus 30% more modules per optical communications device without increasing its power capacity, cutting installation costs.

Also, multi-rate operation (at 9.95-11.1Gbps) via phase-locked loop circuitry eases construction of optical transmission systems of differing transmission rates, such as SONET/SDH, 10 Gigabit Ethernet, and 10Gbps Fiber Channel, says the firm.

Visit: http://global.mitsubishielectric.com