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News
31 July 2007
Suss MicroTec launches coating cluster for wafer bumping and LED manufacturing
Suss MicroTec of Munich, Germany has launched the Gamma XPress coating cluster, targeting wafer bumping as well as high-volume LED manufacturing applications.
The system is offered in different configurations designed for specific applications, including gold bump coating, under bump metal or redistribution coating, high-volume LED coating as well as standard and dry film developing.
Suss MicroTec says that the concept of the Gamma XPress coating cluster combines an efficient and flexible production setup with short lead times, helping to minimize time to market.
Picture: Suss MicroTec's Gamma XPress coating cluster.
See related items:
Suss extends Taiwan partnership with PhotonWealth
NanoWorld buys Suss MicroTec’s ELAN CB6L
Visit: http://www.suss.com
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