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6 March 2019

MACOM expands 400G PAM-4 chipset for data-center optical connectivity with new low-noise TIAs

MACOM Technology Solutions Inc of Lowell, MA, USA (which makes semiconductors, components and subassemblies for analog RF, microwave, millimeter-wave and photonic applications) has announced the availability of production versions of its four-channel (4 x 100G) 56/106Gbit PAM-4 linear transimpedance amplifiers (TIAs) optimized for use in 400G optical modules targeting cloud data-center applications. The new MATA-03820 and MATA-03819 are available in flip-chip and wire-bonding packaging options, respectively, for fast, flexible deployment in single-lambda 400G-FR4 and DR4 format QSFP-DD and OSFP optical modules.

Delivering low noise performance less than 1.5μA RMS typical and supporting bandwidth up to 35GHz, the MATA-03820 and MATA-03819 TIA family supports high-throughput optical data links in a very low power profile, optimal for use in high-density optical data-center interconnects. Features include RSSI for photo-alignment and power monitoring, and I2C management interface for control of bandwidth, output amplitude, peaking, loss of signal (LOS), gain and other key parameters.

“Leveraging MACOM’s technical support along with its broad portfolio of TIAs we are able to ensure the availability of industry-leading 400G optical modules,” comments Adit Narasimha, VP & general manager of Molex Optoelectronics. “The low noise performance of MACOM’s TIA along with its flexible programmability, enable delivery of industry-leading low-bit-error performance when implemented with a DSP for 400G modules,” he adds.

“In the rapid evolution to single-fiber 100G and parallel-fiber 200G and 400G connectivity, we believe that MACOM has again affirmed its leadership position in delivering the high-performance, power-efficient optical components needed to maximize bandwidth density in the cloud data center,” says Marek Tlalka, senior director of marketing, High-Performance Analog, at MACOM. “MACOM’s MATA-03820 and MATA-03819 TIA family, complemented by a comprehensive portfolio of seamlessly interoperable MACOM components, is helping our customers accelerate this transition.”

For those targeting APD applications, MACOM is now sampling its MATA-03921 (flip chip) and MATA-03919 (wire bonded) TIAs.

MACOM is hosting demonstrations of its expanded PAM-4 chipset for 100G, 200G and 400G applications in the MACOM InnovationZone at booth #2739 at the Optical Networking and Communication Conference & Exhibition (OFC 2019) in San Diego, CA, USA (5-7 March), featuring the MATA-03820 and MATA-03819 TIAs in customer module implementations and a live 200G/400G ROSA demonstration.

See related items:

MACOM launches PAM-4 chipset for single-lambda 100G, 200G and 400G data-center optical connectivity

Tags:  M/A-COM

Visit:  www.ofcconference.org

Visit:  www.macom.com/opto

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