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20 March 2019

GaN Systems displays new design tools and resources

At the Applied Power Electronics Conference & Exposition (APEC 2019) in Anaheim, CA, USA (17-21 March), GaN Systems Inc of Ottawa, Ontario, Canada (a fabless developer of gallium nitride-based power switching semiconductors for power conversion and control applications) is displaying a wide range of design tools including new reference designs from partners. The firm says that the unique design resources make GaN easy to incorporate into numerous power system designs, expediting customer go-to-market product releases. These include:

  • The GS-065 low-current 3.5A, 8A and 11A evaluation kit with EZDrive circuit, which eliminates the need for a discrete driver. The kit provides a low-cost solution that offers more design flexibility, reduces the number of components, and is easy to implement.
  • Half-bridge and bridgeless totem pole PFC reference designs utilizing uPI Semiconductor’s drivers and GaN Systems’ 100V GaN E-HEMTs provide cost-effective, higher-efficiency solutions in applications such as 48V (half-bridge) and compact 1U switch-mode power supplies (BTP PFC) for the enterprise market.
  • An advanced half-bridge design solution onboard GaN Systems’ evaluation board using the new 650V GaN E-HEMTs for smaller consumer and enterprise power supply applications that reduces existing PCB footprints and bill of materials (BOM) costs.
  • New high-performance insulated metal substrate (IMS) half-bridge thermal mounting solution, which provides design flexibility and scalability with three power-level configurations up to 1.5kW (GS66504B), 3kW (GS66508B) and 6kW (GS66516B). The optimized driver board features the highest power density due to having the lowest system thermal resistance. The layout also allows for fewer assembly steps and lowers cost of materials.
  • The full 1.5kW bridgeless totem pole PFC reference design using GaN Systems’ 650V E-HEMTs featuring an EMI filter and surge protection that can be utilized in applications such as data-center power supplies to increase efficiency, reduce systems size, and reduce system BOM cost. The evaluation board can also start up to full load condition.
  • In a half-bridge daughter card, a preview of new driver technology from a leading analog and mixed-signal IC manufacturer. These GaN drivers offer safety and protection features, fast loop response, and integrated chip functionality, which helps to reduce component count. The solutions are suited to industrial and automotive markets and offer features not previously available with existing GaN driver ICs.
  • Now available - 50W wireless power amplifier, a small-size, low-cost and high-efficiency evaluation board suitable for wireless power transfer and charging applications (targeted at lower-power applications in industrial and consumer markets).

“The selection of reference designs, circuit simulation tools and evaluation kits from GaN Systems and our ecosystem partners empower design engineers to take advantage of GaN benefits – high efficiency and low size, weight and total system cost – to accelerate product time-to-market,” says Paul Wiener, VP strategic marketing at GaN Systems.

Tags: GaN Systems E-mode GaN FETs Power electronics

Visit:  www.apec-conf.org

Visit:  www.gansystems.com

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