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16 January 2019

ULVAC and OIPT collaborating to bring atomic-scale processing to Japanese power and RF markets

UK-based plasma etch and deposition processing system maker Oxford Instruments Plasma Technology (OIPT) and ULVAC Inc of Chigasaki, Kanagawa, Japan have announced a collaboration to bring leading-edge deposition and etch technology solutions to gallium nitride (GaN)- and silicon carbide (SiC)-based wide-bandgap production customers in Japan.

“Oxford Instruments Plasma Technology is excited to be collaborating with ULVAC in order to bring its proven process solutions to the Japanese power and RF markets,” says OIPT’s managing director Mike Gansser-Potts. “This relationship, which will begin with ULVAC as our channel partner in Japan, will allow local production customers access to Oxford Instruments’ suite of atomic-scale processing solutions,” he adds.

“Our new collaborator, Oxford Instruments Plasma Technology, has critical process technology and know-how which complements our own capabilities,” notes Tetsuya Shimada, general manager of ULVAC’s Advanced Electronics Equipment Division. “Combined with our customer support infrastructure, this will allow us to provide a complete solution to our Japanese customers.”

OIPT says that atomic layer deposition (ALD) and atomic layer etch (ALE) are critical process steps for GaN- and SiC-based devices to enable functionality and reliable device manufacturing. The firm reckons that, with its critical know-how and expertise gained over the last ten years in wide-bandgap applications, it is well placed to serve technology-leading Japanese production customers in these markets.

Tags:  OIPT

Visit:  www.ulvac.co.jp

Visit:  www.oxford-instruments.com/plasma

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