Innovations in Optics buys new F&S BONDTEC automatic die bonder

Innovations in Optics Inc of Woburn, MA, USA has purchased a new Model 5830 automatic wire bonder from F&S BONDTEC of Braunau am Inn, Austria to produce chip-on-board die arrays used in its high-power UV LED light sources.

The new addition will not only expand capacity but also enhance capabilities, increasing efficiency and overall throughput times as well as bringing value-added throughout the entire manufacturing process.

The BONDTEC 5830 can handle bond wire diameters to 3 mils (75m), a critical feature for the high-current-density operation applicable to all LED arrays within products made by Innovations in Optics. Key features of exchangeable bond heads and the ability to store an unlimited number of complex bond programs support the firm’s variety and intricacy of die arrays.

Tags: DUV LEDs

Visit: www.fsbondtec.at

Visit: www.innovationsinoptics.com