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3 April 2019

Veeco presenting at technical conferences in Q2/2019

Epitaxial deposition and process equipment maker Veeco Instruments Inc of Plainview, NY, USA says that its technologists are scheduled to speak at seven technical events throughout second-quarter 2019. The firm says that the presentations, which follow several appearances in Q1/2019, highlight its expertise in working with customers to break through production-scale barriers that will ultimately lead to the wide adoption of game-changing trends in big-data, high-speed communications, artificial intelligence (AI), autonomous vehicles (AVs), high-resolution displays and more.

Through the papers, Veeco explains how it can solve materials engineering challenges with advances in its deposition, etch, lithography and wet processing technologies used in applications such as next-generation advanced packaging, photonics, sensors, MEMS, micro-LEDs, power electronics, high-bandwidth memory and related devices. Presentations in Q2/2019 include:

  • Critical Materials Council Conference (25-26 April; Saratoga Springs, NY) — at the fourth annual forum for discussing actionable information related to semiconductor fab materials, VP of technology Drew Hanser will present ‘Material Integration Challenges for GaN on Si for Power and RF Devices’ on 25 April during Session II: Immediate Challenges of Materials & Manufacturing.
  • CS ManTech (29 April -2 May; Minneapolis, MN) — process development engineer Phillip Tyler will present ‘Development of Advanced Lift Off Processes for 5G and VCSEL Applications’. Also, in booth #609, Veeco is exhibiting its latest innovations in compound semiconductor and wet processing technologies.
  • ECTC (28-31 May; Las Vegas, NV) — chief technology officer Dr Ajit Paranjpe will co-author a presentation on ‘High-Yield Precision Transfer and Assembly of Gallium Nitride (GaN) Micro-LEDs Using Laser Assisted Micro Transfer Printing’ with experts from the University of California, Los Angeles (UCLA).
  • EUVL Workshop (10-13 June; Berkeley, CA) — At this year’s workshop focused on the fundamental science of EUV lithography and its continued extension to support Moore’s Law, principal research scientist Sandeep Kohli will present ‘Ion Beam Technology Roadmap for EUV Mask Deposition and Absorber Etch Processes’.

“Veeco builds production-scale fab solutions that solve tough materials engineering problems,” says chief technology officer Ajit Paranjpe Ph.D. “Our technical contributions to these prestigious and peer-reviewed conferences demonstrate Veeco’s commitment to remaining at the forefront of technological advances.”

Tags: Veeco MOCVD

Visit:  www.veeco.com

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