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17 September 2018

SemiGen boosts contract manufacturing capability

© Semiconductor Today Magazine / Juno PublishiPicture: Disco’s DAL7440 KABRA laser saw.

SemiGen Inc of Manchester, NH, USA – an ISO- and ITAR-registered RF/microwave assembly, automated PCB manufacturing, and RF Supply Center – says that, after moving into its new facility, it has made an additional capital investment of over $0.5m in new production, wafer fab and testing equipment to support customer demand.

The new equipment consists of improvements across the firm’s entire service platform and includes: a new Mycronic MY300 pick & place system; two new Westbond wire bonders, a new Centrotherm eutectic vacuum chamber, new HTOL/HTRB ovens; as well as a new Disco DAD3220 dicing saw. In addition, the firm has made upgrades in its high-frequency testing department, including several new pieces of performance testing and metrology tools.

“Our CEO, Jim Morgan, has said we must do our best to help our customers augment their design, assembly, and hi-rel testing and up-screening capabilities, and it feels great to see this new equipment getting up and running to do just that,” says president Tim Filteau.

SemiGen offers outsourcing to OEMs in the RF/microwave, military, space, homeland security, optical, medical device and commercial wireless markets. Its services and products are designed to fill voids in the manufacturing supply chain and production floor. SemiGen’s design and manufacturing center includes wire bonding to silicon (Si), gallium arsenide (GaAs) and gallium nitride (GaN) chips, RF/microwave and PCB assembly, mixed-signal digital and analog assembly, module repair, and high frequency testing and up-screening services.

In recent years, SemiGen has invested in coupling its services with in-stock product solutions by carrying the diodes, active and passive semiconductor devices, and bonding supplies needed for the production of several types of solid-state, multi-function assemblies (MFAs) and components. Bonding supplies are available for online purchase. The team helps with designs, builds prototypes, and handles volume production runs within its new 37,000ft2 facility, which also includes a class 10,000 cleanroom. Manual to fully automatic assembly solutions are now available.

With its recent upgrades in place, the firm is also offering wafer processing of silicon wafers, as well as processing ceramic substrates. Processing services provided include any combination of photolithography, wet etch, dry etch, metallization, grinding, polishing and in-process metrology.

The recent investments in RF and microwave testing and environmental screening lab has also enabled the firm to offer high-reliability (hi-rel) screening of amplifiers, FETs, MMICs, transistors, diodes and other RF and microwave components operating up into millimeter-wave frequencies.

Tests can be performed and delivered with full documentation in adherence with MIL-PRF-19500, MIL-PRF-38534 and MIL-PRF-38535 requirements. Element evaluation and screening options from Class H, Class K, TX, TXV, S-level, as well as custom SCD driven requirements, are available.

RF and microwave engineers and OEM procurement agents seeking design for manufacturability (DFM) and purchasing consulting on outsourcing their assembly and test can submit their technical or operational related questions on the contact page of the firm’s website.

See related items:

SemiGen announces new foundry capabilities and hi-rel screening services

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Visit: www.semigen.net

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