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1 October 2018

StratEdge displaying GaN and GaAs packages at IMAPS, BCICTS and EDI CON USA

© Semiconductor Today Magazine / Juno PublishiPicture: Disco’s DAL7440 KABRA laser saw.

StratEdge of San Diego, CA, USA (which designs and manufactures packages and provides chip assembly & test services for microwave, millimeter-wave and high-speed digital devices) is displaying its high-frequency, high-speed, thermally efficient packages at the following events:

  • in booth 309 at the International Microelectronics Assembly and Packaging Society’s 51st Symposium on Microelectronics (IMAPS 2018) in Pasadena (9-11 October);
  • in booth 4 at the 2018 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS) in San Diego (14-17 October), which combines the former Compound Semiconductor IC Symposium (CSICS) with the Bipolar/BiCMOS Circuit and Technology Meeting (BCTM); and
  • in booth 224 at the Electronic Design Innovation Conference & Exhibition (EDI CON USA 2018) in Santa Clara (17-18 October).

StratEdge says that its packages meet the extreme demands of gallium nitride (GaN) and gallium arsenide (GaAs) devices and the critical requirements of the telecom, mixed-signal, VSAT, broadband wireless, satellite, military, test & measurement, automotive, down-hole and MEMS markets.

StratEdge is showcasing two options for packaging GaN and high-power semiconductor devices, the LL family of leaded laminate copper-moly-copper (CMC) base packages and its off-the-shelf line of molded ceramic packages that can be configured to meet the requirements for chips operating at frequencies up to 18GHz. These packages dissipate heat and come in fully hermetic versions in over 200 standard outlines.

StratEdge is also featuring its complete line of post-fired and molded ceramic semiconductor packages operating from DC to 63+GHz. These packages have electrical transition designs that ensure low electrical losses and operate efficiently, even at the highest frequencies. All packages are lead-free and most meet RoHS and WEEE standards.

“Since StratEdge started manufacturing packages for semiconductor devices in 1992, we have seen the demand for high-speed, high-frequency, data-intensive technologies multiply,” says president Tim Going. “This is reflected in the interest in these events.”

See related items:

StratEdge receives ISO 9001:2015 quality management system certification

Tags: StratEdge

Visit: www.stratedge.com

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