Temescal

Semigas

CLICK HERE: free registration for Semiconductor Today and Semiconductor Today ASIACLICK HERE: free registration for Semiconductor Today and Semiconductor Today ASIA

Join our LinkedIn group!

Follow ST on Twitter

IQE

28 August 2018

MRSI launches MRSI-H3TO die bonding product family targeted at 5G wireless network supply chain

© Semiconductor Today Magazine / Juno PublishiPicture: Disco’s DAL7440 KABRA laser saw.

MRSI Systems of North Billerica, MA, USA (which manufactures fully automated, high-precision eutectic and epoxy die bonding systems) is launching the MRSI-H3TO, a new 3μm high-speed die bonder that will be the first of its kind to address the multi-die and multi-process requirements, delivering what is claimed to be industry-leading throughput, superior flexibility, and future-proven 3mm placement accuracy.

The MRSI-H3TO is tailored for WDM/EML-TO or other multi-die multi-processing TO-can photonic devices to support the upcoming 5G wireless network, enabling photonics customers to meet their manufacturing challenges by allowing them to stay competitive in such a high-volume and high-mix production environment.

The upcoming 5G wireless deployment will need higher bandwidth in signal transportation through front-haul and back-haul fiber-optic systems within the fiber-to-home/premise (FTTH/P) network. As a result, WDM and EML types of lasers and other multi-die optical receivers in TO-can packages are required. MRSI says that these new TO-can based devices demand a new class of high-speed die bonder that is capable of multi-die and multi-process production in one machine, in order to achieve the best throughput.

The new MRSI-H3TO builds on the key technological building blocks featured in the field-proven high-speed MRSI-HVM3 platform, including a dual-head motion system that performs TO pick-and-place/handling and die bonding in parallel. In addition, it encompasses MRSI’s on the ‘on-the-fly’ auto tool changer that has 12 vacuum tips/collets integrated on the bonding head for zero-time tool change between dies.

“The new MRSI-H3TO is exactly the type of die bonder our customers were demanding to manufacture the next generation of TO-can photonic devices, such as WDM and EML-TOs,” says MRSI’s VP of product management Dr Yi Qian. “It has the industry-leading throughput without sacrificing flexibility, accuracy or reliability,” he claims.

“MRSI is pleased to meet the new market needs to support 5G wireless deployment with the launch of our new high-speed, flexible die bonder for high-volume manufacturing of TO-can based photonic packaging,” says MRSI’s president Michael Chalsen.

MRSI Systems is exhibiting at the 20th China International Optoelectronic Expo (CIOE 2018) with its partner CYCAD Century Science and Technology (booth #1C66) in Shenzhen (5-8 September) and in booth #577 at the 44th European Conference on Optical Communications (ECOC 2018) in Rome, Italy (24-26 September).

See related items:

MRSI launches MRSI-HVM3P die bonder for new photonics applications

MRSI launches high-speed die bonder for photonics high-volume manufacturing

Tags: Die Bonder

Visit: www.cioe.cn/en

Visit: www.ecocexhibition.com

Visit: www.mrsisystems.com

Share/Save/Bookmark
See Latest IssueRSS Feed

AXT