Temescal

Semigas

CLICK HERE: free registration for Semiconductor Today and Semiconductor Today ASIACLICK HERE: free registration for Semiconductor Today and Semiconductor Today ASIA

Join our LinkedIn group!

Follow ST on Twitter

IQE

5 June 2017

Element Six develops new thermal grade of CVD diamond heat spreader for high-frequency, high-power-density devices

Luxembourg-registered synthetic diamond materials firm Element Six (E6), a member of the De Beers Group of Companies, has developed a new thermal grade of synthetic diamond grown by chemical vapor deposition (CVD). Diafilm ETC700 is both thermally and electrically conductive and is suited to effectively managing heat in high-frequency, high-power-density devices, says the firm.

With a thermal conductivity of up to 700W/mK, Diafilm ETC700 CVD diamond heat spreaders are three times more effective in spreading heat than alternative ceramic solutions, reckons Element Six. This electrically conductive all-diamond solution does not require the metal coatings typical of other heat-management materials, resulting in reduced frequency-dependent conductive losses. Diafilm ETC700 is also claimed to outperform other commercially available metallized, non-diamond heat spreader materials or common metal solutions. A larger conduction cross-section enables better RF performance by improving the ground-plane isolation. Diafilm ETC700 maintains a high bulk thermal conductivity, while the bulk electrical conductivity reduces capacitive coupling between ground planes at low frequencies, and reduces conductive losses at higher frequencies.

Element Six claims that its range of Diafilm heat spreaders (available in a range of sizes, thicknesses and metallization) has the highest known thermal conductivity of any solid material at room temperature. With the addition of Diafilm ETC700, Element Six has expanded its portfolio to a total of six material grades spanning several levels of thermal, electrical performance and cost points, ranging from 700W/mK to 2000W/mK.

“For more than two decades, Element Six’s CVD diamond has proven to be the most effective heat management material, far surpassing the performance of competing materials such as copper or ceramics,” claims business development manager Thomas Obeloer. “Our team of developers is committed to continually improving upon our already industry-leading technology to meet new demands in advanced electronics and high-frequency devices.”

CVD diamond is said to be a superior material for high-power-density/high-frequency devices due to a unique combination of properties including high thermal conductivity, mechanical strength, electrical insulation, low weight and chemical inertness. Diafilm ETC700 is claimed to offer better electrical device operation, lower operating temperatures and improved reliability and longer lifespans for high-frequency active semiconductors.

See related items:

Element Six presenting diamond heat spreaders for thermal management of hotspots in GaN devices

Element Six Technologies to accelerate synthetic diamond development in 2015

Element Six launches thermal grade of CVD diamond for heat management

Tags: Element Six Technologies GaN-on-diamond

Visit:  www.e6.com/thermal

Share/Save/Bookmark
See Latest IssueRSS Feed

AXT