18 July 2017
Veeco CNT ships 500th ALD system to NCSU
Thin-film etch and deposition process equipment maker Veeco Instruments Inc of Plainview, NY, USA says that Veeco CNT (formerly Ultratech/Cambridge Nanotech), based in Waltham, MA, has shipped its 500th atomic layer deposition (ALD) system to North Carolina State University (NCSU). The Veeco CNT Fiji G2 ALD system will enable the university to perform a variety of research applications for next-generation electronic devices, including high-performance wearables and sensors.
On 26 May, Veeco acquired Ultratech Inc of San Jose, CA, USA (which makes lithography, laser-processing, inspection and ALD systems for the manufacturing of semiconductor devices and LEDs) for $862m. Over the past 15 years since being spun off from Harvard University’s Gordon Lab, the CNT business (which was acquired by Ultratech in 2012) has provided ALD systems for a wide range of university R&D and commercial applications including biomedical, electronics, energy, and optical.
“The Veeco CNT Fiji G2 ALD system will be a critical tool to meet our ambitious research goals,” says Bongmook Lee Ph.D., research assistant professor at NCSU’s National Science Foundation (NSF) Nanosystems Engineering Research Center for Advanced Self-Powered Systems of Integrated Sensors and Technologies (NERC-ASSIST) Center. “This ALD tool enables advances in our research for high-performance CMOS, non-volatile memory, next-generation wide-bandgap power devices, and environmental and physiological sensors,” he adds. “We selected the Veeco CNT Fiji G2 for its demonstrated ability to reliably deposit the most challenging oxide and nitride thin films… We continue to engage in a strong relationship with Veeco CNT.”
The Fiji G2 ALD system is a thin-film next-generation ALD system capable of performing thermal and plasma-enhanced deposition in a modular, high-vacuum, flexible architecture that accommodates a wide range of deposition modes using multiple configurations of precursors and plasma gases. The intuitive interface is said to make it easy to monitor and change recipes and processes as required by customers.
“Our 500th ALD system shipment validates the increasing interest in ALD technology,” says Ganesh Sundaram Ph.D., vice president of Applied Technology, Veeco CNT. “Now, with the backing of Veeco, we will continue our legacy to build and enhance the deployment of ALD technology, helping customers like North Carolina State University develop next-generation electronic devices.”
Veeco CNT is a platinum sponsor of the 17th International Conference on Atomic Layer Deposition (ALD 2017) in Denver, CO (15-18 July), while presenting several papers:
- AS‐SuA5 – ‘Developing a Full Wafer‐scale Approach Towards High ALD Selectivity on Copper vs Low‐K (and Oxides) using a Single ALD/SAMS Platform’ by Laurent Lecordier (Ultratech) and S. Armini and S. Herregods (IMEC, Belgium);
- AA‐SuP51 – ‘Color Modification of Metal Surfaces by Transparent ALD Film Stacks’ by Ritwik Bhatia and A. Bertuch (Ultratech);
- AF‐MoP24 – ‘Measurement and Control of Stress of ALD Films and Nano‐laminates Measured by Interferometry’ by Ritwik Bhatia (Ultratech);
- EM-MoP12 – ‘In Situ Characterization of Thin Film Molybdenum Carbide using Spectroscopic Ellipsometry’ by Adam Bertuch (Ultratech), J. Hoglund (SemiLab), L. Makai (Semilab), J. Byrnes (SemiLab), J. McBee and G. Sundaram (Ultratech); and
- AA1‐TuA13 – ‘Mechanical, Physical, and Electrical Properties of Plasma‐Enhanced Atomic Layer Deposition of TiVN’ by Mark Sowa (Ultratech), N. Strandwitz, L. Ju (Lehigh University), A. Kozen (US Naval Research Laboratory), and B. Krick (Lehigh University).