29 August 2017
MRSI to demo new MRSI-HVM3 and sponsor 1st Laser Executive Forum at CIOE
At the 19th China International Optoelectronics Exposition (CIOE 2017) at the Shenzhen Convention and Exhibition Center in Shenzhen (6-9 September), MRSI Systems of North Billerica, MA, USA (which manufactures fully automated, high-precision die bonding and epoxy dispensing systems) is exhibiting in booth #1C66 with its Chinese representative CYCAD Century Science and Technology.
In private demonstrations of its new MRSI-HVM3 system, the firm will demonstrate it completing chip on carrier (CoC) eutectic and epoxy bonding.
MRSI is offering the new 3µm die bonder for high-volume manufacturing of photonic, sensor and semiconductor devices. The system is said to deliver high speed without sacrificing precision and flexibility by incorporating MRSI’s latest hardware and software innovations. This yields what is claimed to be best-in-class throughput for capacity expansion, high accuracy for advanced high-density product packaging, and unmatched flexibility for multi-chip production in one machine.
At this year’s CIOE, MRSI is sponsoring ‘The 1st Executive Forum on Laser Technologies’ (6-7 September), at which industrial and academic leaders will discuss new laser technologies and applications in communications, sensors, industrial and other emerging areas.