2 August 2017
LioniX and Heinrich Hertz Institute intensify collaboration
LioniX International BV (LXI) of Enschede, The Netherlands (which provides customized integrated photonics-based microsystems) and Fraunhofer HHI (Heinrich Hertz Institute) in Berlin, Germany (a research center for mobile and stationary communication networks) are strengthening their collaboration by actively supporting the integration of their respective photonic integrated circuit (PIC) platforms. Combining the functionalities of both platforms enables new applications, ranging from telecoms and datacoms to bio-photonics, sensing and metrology. Both platforms have their own unique properties that are complementary, as was demonstrated in the recent realization of record ultra-low-linewidth lasers (290Hz linewidth).
HHI and LXI will both actively supply engineering resources to support combination of the two platforms.
Branded TriPleX, LioniX’s PIC platform is based on stoichiometric silicon nitride proprietary waveguide technology realized by low-pressure chemical vapor deposition (LPCVD). The platform is complementary to HHI’s indium phosphide (InP) platform, as it is ultra low loss (from 405nm to 2350nm) and has the ability to create spot size converters, enabling optimized conversion between the mode profiles in, for example, HHI’s InP chips as well as many types of fibers.
“Our unique hybrid integration capabilities support our customers that demand fully assembled photonic integrated circuit modules,” says LXI’s CEO Hans van den Vlekkert. ”With HHI we have found a supplier that supports our vertical integrated approach to our photonic IC module manufacturing”.
HHI’s PIC platform relies on InP, offering a wide range of optical functionalities such as light sources, detection, amplification and phase control in the wavelength region 1200-1650nm. Its portfolio of commercial products includes: high-speed photodiodes and balanced detectors, high-speed Mach-Zehnder and other modulators, as well as a wide variety of laser products. In addition, HHI’s platform for customer-specific PICs, enhanced by LXI’s low-loss PICs, allows a large range of products targeting a wide range of applications.
“Developing a standard interface between active and passive PICs allows for experience accumulation over many different designs and thus benefits hybrid integration and its industrial and academic users,” comments HHI’s director Martin Schell.