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30 June 2016

SUSS MicroTec launches fourth generation of semi-automated mask and bond aligners

SUSS MicroTec of Garching, Germany has launched the MA/BA Gen4 series, the new generation of its semi-automated mask and bond aligners which extends its capabilities with major improvements in alignment accuracy, ergonomic design and further reduced cost of ownership.

With this fourth generation, SUSS MicroTec is introducing a new platform system. The two platform types are configured differently and consist of the MA/BA Gen4 for standard processes and the MA/BA Gen4 Pro series for high-end processes. By moving to this new platform concept, SUSS MicroTec says that it is further optimizing its mask aligner product portfolio to better align with customer requirements.

The main application of the MA/BA Gen4 series is full-field lithography in academia, MEMS, 3D integration and the compound semiconductor market. Furthermore, it handles processes such as bond alignment, fusion bonding and SMILE imprint. In addition to standard wafer processing, the MA/BA Gen4 series can reliably process delicate substrates, such as fragile, warped or uneven surfaced wafers.

"With this new platform concept, we further align with different customer requirements – the MA/BA Gen4 for standard lithography processes or the leading-edge MA/BA Gen4 Pro for small-series production and more demanding solutions, e.g. our Soft Conformal Imprint Lithography (SCIL) solution," says CEO Dr Per-Ove Hansson.  

Tags: Mask alignment system

Visit: www.suss.com/en/products-solutions/products/mask-aligner/maba-gen4-series

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