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2 September 2014

MACOM launches most integrated 10G SFP+ optical module chipset

M/A-COM Technology Solutions Inc of Lowell, MA, USA (which makes analog semiconductors, components and subassemblies for analog, RF, microwave and millimeter-wave applications) has launched what is claimed to be the most integrated 10G chipset, suitable for 10G/12G SFP+ and XFP optical module designs. The chipset consists of a transimpedance amplifier (TIA) along with an integrated laser driver and a limiting amplifier, with the option of an integrated clock & data recovery (CDR).

The chipset will enable SFP+ form-factor modules with less than 800mW maximum power across operating conditions. MACOM offers a complete proven SFP+ reference design for quick seamless module designs.

The M02193 is a laser driver integrated with a limiting amplifier that supports data rates from 1Gbps to 12.5Gbps, while the M02190 is a laser driver integrated with reference-free CDR supporting data rates from 9.95Gbps to 11.7Gbps. Both laser drivers are designed to DC-couple to the laser diode in order to reduce overall power dissipation, eliminating external biasing circuits.

The laser drivers offer what is claimed to be the first 10G closed-loop extinction ratio (ER) control that eliminates the cumbersome laser look-up table calibration in production. Users only need to set the target ER and the laser drivers will automatically maintain this ER across operating conditions.

The M02190 and M02193 devices offer what is claimed to be the highest integration in the industry with on-chip controller, EEPROM memory and an APD DC-DC controller, providing a complete solution reducing overall system costs. Completing the chipset is the M02131 low-power, high-sensitivity TIA, which consumes less than 100mW typical power with better than -20dBm sensitivity.

“Our latest 10G chipset offers the industry’s highest integration, lowering overall bill of material costs,” says Angus Lai, MACOM’s product marketing director, High Performance Analog. “With its best-in-class power consumption and link margin, it is the ideal solution for new 10G SFP+ module designs,” he claims.

MACOM is highlighting the new 10G chipset alongside established physical media device (PMD) solutions in booth # 1B73 at the China International Optoelectronic Exposition (CIOE 2014) at the Shenzhen Convention & Exhibition Center (2-5 September).

Tags: M/A-COM

Visit: www.macom.com

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