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10 November 2014

Plessey advances to chip-scale and wafer-level packaging, targeting application-specific LEDs

UK-based Plessey has expanded into chip-scale packages and wafer-level packaging, leading to its application-specific AS-LED.

The firm says that recent performance improvements in key areas (including lumens/watt) have elevated its gallium nitride on silicon (GaN-on-Si) technology MaGIC (Manufactured on GaN-on-Si I/C) high-brightness LEDs (HBLEDs) to be competitive with any LED technology.

“Our most recent advancements in performance to greater than 50% wall-plug efficiency, coupled with our unique semiconductor technologies and manufacturing capabilities, have pushed us to our next stage of technology development,” says chief technology officer Dr Keith Strickland. “We will have our first chip-scale package solution available for sampling later this quarter,” he adds.

“We need to move the conversation from lumens/watt to how the semiconductor industry can provide the capability for mass customization needed for the solid-state lighting industry,” Strickland continues. “Our LED components are more than competitive with any sapphire or silicon carbide solution, but the industry needs far more,” he adds. “We believe our AS-LED provides the solution to the mass customization needed in the solid-state lighting markets.”

Plessey’s range of products for lighting applications and fixtures is being showcased in stand D31 at LuxLive (the UK’s biggest lighting show) at ExCel London (19-20 November).

Tags: Plessey GaN-on-Si HB-LEDs

Visit: www.plesseysemiconductors.com/led-plessey-semiconductors.php

Visit: www.luxlive.co.uk

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