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17 November 2014

LayTec's in-situ metrology used in Aixtron's new AIX R6 HB-LED reactor

In-situ metrology system maker LayTec AG of Berlin, Germany says that the reactor feedback control capabilities of Aixtron's latest generation of metal-organic chemical vapor deposition (MOCVD) system (AIX R6) for manufacturing high-brightness light-emitting diodes (HB-LEDs) - launched on 6 November at the 11th China International Forum on Solid State Lighting (SSL CHINA 2014) - are based on two fully integrated LayTec OEM metrology sub-systems (Inside MiniR and Inside TTC) with typically seven metrology heads in total.

Emissivity-corrected susceptor surface temperature and double-wavelength reflectance is provided by industry-proven LayTec in-situ metrology. As additional options, wafer bow and GaN surface temperature can also be measured by Inside MiniRC and Inside P400 (OEM versions of LayTec’s Pyro 400 pyrometry tool).

The engineering teams of Aixtron and LayTec worked closely together to provide the in-situ metrology solution for both firms’ customers in the LED industry.

See related items:

Aixtron launches AIX R6 next-generation MOCVD system

Tags: LayTec Metrology Aixtron MOCVD GaN LEDs

Visit: www.aixtron.com

Visit: www.laytec.de

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