Temescal

Semigas

CLICK HERE: free registration for Semiconductor Today and Semiconductor Today ASIACLICK HERE: free registration for Semiconductor Today and Semiconductor Today ASIA

Join our LinkedIn group!

Follow ST on Twitter

IQE

24 November 2014

Anadigics' front-end IC enabling WiFi connectivity in Huawei's new Ascend Mate 7 smartphone

Broadband wireless and wireline communications component maker Anadigics Inc of Warren, NJ, USA is shipping production volumes of its AWL9281 front-end integrated circuit (FEIC) to Huawei for the new Ascend Mate 7 which, with a 6.0-inch display, 2.9mm narrow bezel and 7.9mm ultra-thin metal body, is reckoned to be one of the most compact large-screen smartphones on the market.

This latest design win strengthens Anadigics’ long history of powering wireless connectivity in Huawei’s devices, says Jerry Miller, senior VP of worldwide sales & applications.

Anadigics’ family of WiFi FEICs leverages its patented InGaP-Plus technology and design architectures to combine a power amplifier (PA), low-noise amplifier (LNA) with bypass option, and SP3T Tx/Rx RF switch with Bluetooth on a single die. This level of integration greatly improves manufacturability and reliability, reduces PCB space requirements, and simplifies RF front-end design to speed time-to-market, says Anadigics.

The compact 2.5mm x 2.5mm x 0.4mm QFN package also incorporates a high-accuracy integrated power detector and RF ports internally matched to 50 Ohms to reduce PCB space requirements.

The AWL9281 FEIC provides what is claimed to be outstanding error vector magnitude (EVM) and noise figure performance, enabling high data throughput. The AWL9281 also delivers low current consumption, extending battery-life in mobile applications.  

Tags: Anadigics

Visit: www.anadigics.com

Share/Save/Bookmark
See Latest IssueRSS Feed

AXT