Temescal

Semigas

CLICK HERE: free registration for Semiconductor Today and Semiconductor Today ASIACLICK HERE: free registration for Semiconductor Today and Semiconductor Today ASIA

Join our LinkedIn group!

Follow ST on Twitter

IQE

10 March 2014

Skyworks launches flip-chip packaged switch/LNA front-ends to shrink footprint in smartphones and tablets

Analog semiconductor maker Skyworks Solutions Inc of Woburn, MA, USA has unveiled several wireless networking products incorporating flip-chip packaging, augmenting its existing mobile connectivity portfolio.

Skyworks says that its newest devices leverage proprietary manufacturing techniques that allow smartphone and tablet OEMs to incorporate smaller, thinner solutions for 802.11ac system-in-package (SiP) modules. As high-end mobile devices deliver ever-increasing functionality and ubiquitous connectivity, reducing the front-end circuit board footprint is critical as system providers seek high-performance, highly flexible solutions for next-generation platforms.

“Unique flip-chip packaging capabilities are enabling us to offer unprecedented form factors in support of flagship smartphones and tablets,” says Bill Vaillancourt, VP & general manager of mobile connectivity solutions. “Our newest wireless networking devices are highly integrated and solve our customers’ analog and RF complexity challenges so consumers can enjoy mobile platforms with fast, reliable anytime, anywhere data access,” he adds.

As a surface-mountable technology, flip-chip packaging reduces footprint and thickness (compared to conventional packaging), weighs less, is easy to assemble, lowers production costs and improves electrical and thermal performance, says Skyworks. Flip-chip solutions combine the strengths of various packaging techniques, such as the size and performance advantage of bare die assembly with the reliability of encapsulated devices that can also be fully RF tested at die level. Their size and weight reductions makes them suitable for use in a variety of mobile devices including smartphones and tablets, adds the firm.

Skyworks’ new connectivity solutions include the following devices:

  • SKY85202-11 - a single-pole, triple-throw (SP3T) switch with an integrated low-noide amplifier (LNA) for 2.4GHz, 802.11ac modules;
  • SKY85606-11 - a single-pole, double-throw (SP2T) switch with an integrated LNA for 5GHz, 802.11ac modules.

Both devices are highly integrated and feature an LNA with bypass mode, low-loss RF switch and DC blocking capacitors in a single, compact flip-chip package. In addition, these Skyworks Green products are compliant with all applicable legislation and are halogen-free.

Additional products in this portfolio will be released later this year.

Tags: Skyworks

Visit: www.skyworksinc.com

Share/Save/Bookmark
See Latest IssueRSS Feed

AXT