CLICK HERE: free registration for Semiconductor Today and Semiconductor Today ASIACLICK HERE: free registration for Semiconductor Today and Semiconductor Today ASIA

5 February 2013

École Polytechnique Fédérale de Lausanne orders Veeco ion beam etch system

Epitaxial deposition and process equipment maker Veeco Instruments Inc of Plainview, NY, USA says that Switzerland’s École Polytechnique Fédérale de Lausanne (EPFL) has ordered a NEXUS ion beam etch (IBE) system, to be used for R&D projects in micro- and nano-fabrication. Veeco’s IBE systems are used to etch precise, complex features for high-yield production of discrete microelectronic devices and components.

“Ion beam etch is important in our micro- and nano-fabrication because we need the ability to accurately etch difficult-to-etch materials and multi-layer stacks used in today’s emerging applications,” says EPFL’s Dr Philippe Flückiger director of operations. “Veeco’s technology also provides us a level of precision in defining our structures not available with other dry etching techniques,” he adds. 

“Given the growing trend of thin-film-based sensors being used in various consumer applications, we are very excited that our IBE technology has been selected by a new customer – EPFL – which is a top European research institution,” comments Veeco’s VP & general manager Vivek Vohra. “We look forward to supporting their innovative research and industry collaborations.” Veeco’s IBE and other technologies are used globally for etching/depositing various thin films to produce micro-electro-mechanical systems (MEMS) and magnetic sensors.

Tags: Veeco ion beam etch

Visit: www.epfl.ch

Visit: www.veeco.com

Share/Save/Bookmark
See Latest IssueRSS Feed

This site uses some harmless cookies in order to function click here to view our Cookie and Privacy Policy