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23 October 2012

Brewer Science introduces next-generation  debonder for compound semiconductor substrates

Brewer Science Inc of Rolla, MO, USA, which provides specialty materials, integrated processes, and laboratory-scale wafer processing equipment, has introduced a next-generation thermal slide debonder that enables high-temperature slide-off of thinned compound semiconductor substrates in a research and development or low-volume production environment.

"The Cee 1300CSX debonder is designed to meet the challenges of handling thinned compound semiconductor substrates,” said Wayne Farrar, director of the Equipment Business Group at Brewer Science. “We have separated many types of exotic wafers thinned to a thickness of less than 50┬Ám with excellent results.”

Features of the new Cee 1300CSX debonder include:

  • precision lower platen z-position control;
  • programmable electronic lift pins (loading/unloading);
  • compact footprint;
  • flexible substrate sizes;
  • constant force mode;
  • data logging; and
  • excess force sensing.

Tags: Brewer Science

Visit: www.brewerscience.com

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